A conductive contact element is characterized by molding and curing a conductive silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane having at least two aliphatic unsaturated groups represented by the average compositional formula (1):

R¹_nSiO_(4-n)/2  (1)

wherein R¹ is each independently a substituted or unsubstituted monovalent hydrocarbon group, and n is a positive number of 1.98 to 2.02, (B) 300-700 parts by weight of a granular silver powder having a tap density of up to 2.0 g/cm³ and a specific surface area of up to 0.7 m²/g, and (C) an effective amount to cure component (A) of a curing agent for component (A).