An integrated circuit comprises at least one circuit element having at least one bond site and a passivation layer. The bond site is accessible through an aperture in the passivation layer. At least two ball bumps are disposed at the bond site. A first ball bump is bonded to the bond site, and each additional ball bump is bonded on a previously bonded ball bump so that the height of the ball bumps is greater than the thickness of the passivation layer above the bond site. A ball bond is bonded to an uppermost ball bump and has a wire formed integrally therewith.