A semiconductor package device includes an insulative housing, a semiconductor chip, and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the bottom surface includes a peripheral portion and a central portion within the peripheral portion, the peripheral portion protrudes downwardly from the central portion, the chip includes a conductive pad, and the lead protrudes laterally from and extends through the peripheral side surface and is electrically connected to the pad.