A system for removing heat from a plurality of electronic assemblies including
a cabinet having brackets for supporting electronic assemblies in a vertical array
between a first vertical airflow path and a second vertical air flow path of the
cabinet, and a plinth underlying the cabinet and having an input port receiving
air from the first vertical airflow path of the cabinet, an output port transmitting
air to the second vertical air flow path, a heat exchanger positioned in an air
flow path extending between the input and the output ports, and a fan assembly
for driving air through the heat exchanger and towards the input port. The system
further includes at least one air flow distribution device establishing a predetermined
flow rate distribution through electronic assemblies supports by the brackets.