A method for manufacturing an electronic component includes the steps of forming an electrode layer including -tungsten on a substrate at a substrate temperature of about 100 C. to about 300 C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes -tungsten, and has a specific resistance of about 15 .cm or less and a warpage of about 120 m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including -tungsten.