Disclosed is a circuit pattern inspection apparatus for inspecting a conductive pattern of a circuit board which includes first and second comb-shaped conductive patterns 15a, 15b each having a plurality of terminal portions arranged substantially parallel to each other and a base portion connecting respective anchor ends of the terminal portions together, wherein the terminal portions of the first comb-shaped conductive pattern are alternately arranged with respect to the terminal portions of said second comb-shaped conductive pattern, and the first second comb-shaped conductive patterns 15a, 15b are adapted, respectively, to be supplied with an AC inspection signal, and grounded. The circuit pattern inspection apparatus comprises first and second detection means 20, 30 each having a detection electrode for detecting a signal from the first and second comb-shaped conductive patterns, and a scalar robot 80 operable to move each of the first and second detection means 20, 30 across common ones of the terminal portions, while allowing them be capacitively coupled with the terminal portions. The first and second detection means 20, 30 generates detection signals allowing the presence of a defect in each of the terminal portions to be determined based thereon. The inspection apparatus of the present invention can inspect a defect in a circuit pattern reliably and readily.