To provide a thermal connection that can withstand mechanical stress in a high temperature structure comprising a panel having one face carrying a circuit made up of tubes in which a fluid flows, the outside walls of the tubes are covered in respective high thermal conductivity textile layers. The structure further comprises holding means for holding the tubes pressed in non-rigid manner against the panel. The structure enables heat exchange to take place between the panel and the fluid in order to cool the panel, to heat the fluid, or indeed in order to do both.