A heat dissipation device includes a first heat sink (10), a second heat sink (20) and at least one heat pipe (30). The first heat sink includes a first base (12) and a plurality of fins (14). The second heat sink includes a second base (22) and a plurality of fins (24). The second heat sink is located above and faced to the first heat sink. At least one fin (15) of the first heat sink forms a bifurcated portion (152) at an upper section thereof. A corresponding fin (25) of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.