A low-k dielectric for use as an interlayer for an interconnect structure is
provided.
The dielectric of the present invention is an alkaline boron silicate glass which
when formulated in certain compositional ranges can undergo spinodal decomposition
when processed using certain thermal profiles. Spinodal decomposition is a chemical
and physical separation of the silicate glass into a distinct interpenetrating
microstructure which contains a substantially pure silicon dioxide network and
a boron-rich network. The dimension (i.e., scale), and the amount of separation
can be controlled through compositional and thermal control during the processing
of the silicate glass.