A light-emitting semiconductor device (10) consecutively includes a sapphire
substrate (1), an AlN buffer layer (2), a silicon (Si) doped GaN
n+-layer (3) of high carrier (n-type) concentration, a Si-doped
(Alx3Ga1-x3)y3In1-y3N n+-layer
(4) of high carrier (n-type) concentration, a zinc (Zn) and Si-doped (Alx2Ga1-x2)y2In1-y2N
emission layer (5), and a Mg-doped (Alx1Ga1-x1)y1In1-y1N
p-layer (6). The AlN layer (2) has a 500 thickness. The
GaN n+-layer (3) has about a 2.0 m thickness and a 21018/cm3
electron concentration. The n+-layer (4) has about a 2.0
m thickness and a 21018/cm3 electron concentration.
The emission layer (5) has about a 0.5 m thickness. The p-layer 6
has about a 1.0 m thickness and a 21017/cm3 hole
concentration. Nickel electrodes (7, 8) are connected to the p-layer (6)
and n+-layer (4), respectively. A groove (9) electrically
insulates the electrodes (7, 8). The composition ratio of Al, Ga, and In
in each of the layers (4, 5, 6) is selected to meet the lattice constant
of GaN in the n+-layer (3). The LED (10) is designed to
improve luminous intensity and to obtain purer blue color.