An apparatus for cooling of electronic components of the present invention are provided with a heatsink and a blower with an electric drive. The heatsink comprises a base and heat exchanging means. The electric drive comprises a stator and a rotor with an axle; the stator is rigidly built-in to the heatsink. The blower comprises a radial type magnetized impeller as the rotor. The base provides thermal contact with the electronic component and the heat exchanging means. The base is comprised of at least two layers composite material thereof including at least one layer of electrically insulating material and at least one layer of thermally and electrically conductive material that including the stator.