A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.