A semiconductor package mainly comprises a substrate unit and a chip. The chip
is electrically connected to the substrate unit. The substrate unit includes an
upper surface, a lower surface and a side surface. A plurality of circuit traces
are formed on the upper surface and a plurality of contacts are formed on the side
surface, wherein the contacts are electrically connected to the circuit traces.
Besides, a plurality of solder balls are formed on the contacts in order to transmit
the signals from chip to outside through the substrate unit, the contacts and the
solder balls. Furthermore, a semiconductor package module will be formed by electrically
connecting the semiconductor packages with each other through solder balls and
a module substrate, and mounting the semiconductor packages with each other through
an adhesive layer. In addition, a method for manufacturing the semiconductor package
is disclosed.