A substrate compiling system includes an actuator, cable and tamper device. The
tamper device includes a clamp assembly. The clamp assembly is retracted and extended.
The clamp assembly can be used to clamp an edge of each compiled set of substrates
and transfer the compiled set to a stacking tray, platform or the like. The clamp
assembly may remain in an extended position until all other substrate supporting
structures no longer support the substrates and an opposing unclamped edge of the
compiled set engages the stacking tray below.