A method for packaging and singulating a wafer having a plurality of micro devices
includes providing a multi-lid substrate having a trench having intersection portions
and non-intersection portions formed on a first side of the multi-lid substrate.
The multi-lid substrate is coupled to the wafer such that the intersection portions
of the trench pattern extend adjacent to at least three micro devices. Portions
of the multi-lid substrate between a second side of the multi-lid substrate and
the trench pattern are removed while the multi-lid substrate is coupled to the wafer.