Methods, and materials made by the methods, are provided herein for treating materials with a particle beam processing device. According to one illustrative embodiment, a method for treating a material with a particle beam processing device is provided that includes: providing a particle beam generating assembly including at least one filament for creating a plurality of particles; applying an operating voltage greater than about 110 kV to the filament to create the plurality of particles; causing the plurality of particles to pass through a thin foil having a thickness of about 10 microns or less; and treating a material with the plurality of particles.