A method for preparing an IC card, the IC card has an IC module within an adhesive layer between first substrate and second substrate. In the method, an adhesive containing diphenylmethanediisocyanate an amount of less than percent by weight based on the whole amount the adhesive and having an elongation at fracture adhesive of 150-1,500 percent after complete curing is employed, and the blanc IC card sheet is cut when an elongation at fracture of the adhesive of 5-500 percent prior to complete curing.