A tower-type heat pipe (10) includes a metal plate (20), a heat pipe with a container (30) and a wick (32), and a cover (40). The heat pipe is vertically mounted on the metal plate. A solder (50) is used to soldering an outer wall of the container with the metal plate and a top of the container with the cover. An air gap (27) is defined in the metal plate and located between the solder and the wick along a flowing path of the solder in order to prevent the solder from flowing into an inside of the container to contaminate the wick.