The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability. The resin composition for semiconductor encapsulation comprises: (A) an epoxy resin; (B) a phenolic resin; (C) a latent curing accelerator; and D) an inorganic filler, and has a viscosity of 7,000 poise or more at 25 C. and 5,000 poise or less at 80 C.