An information processing device is disclosed. The information processing device includes a heal dissipation plate structure including a thermally conductive material, and a processor including a major surface. A heat dissipating material is between and couples the processor and the heat dissipation plate structure. An array of pins is substantially perpendicular to the major surface of the processor. The device also includes a substrate including a plurality of holes, where the pins in the array of pins are configured to be inserted into the holes in the substrate.