According to the present invention, when a semiconductor element having
protruding electrodes formed thereon is connected to a circuit board via conductive
resin, stable connection is made even when an electrode pitch is small on the semiconductor
element. On semiconductor element package regions on the circuit board, a paste
electrode material containing photopolymerizable materials is printed to form a
film having a prescribed thickness, and this electrode material film is baked after
exposure and development thereof so as to obtain circuit electrodes having edges
warped in a direction of going apart from the circuit board surface. Then, the
protruding electrodes and the concave surfaces of the circuit electrodes are brought
in abutment with each other and connected via the conductive resin which surrounds
the abutments between the respective electrodes and is held on the concave surfaces
of the circuit electrodes. With this arrangement, the concave surfaces of the circuit
electrodes act as saucers and prevent the conductive resin from being squeezed
out, thereby eliminating possible occurrence of short circuits.