A pressure sensor includes a substrate having a top metallized pad formed on the top surface and a bottom metallized pad formed on the bottom surface. These pads are divided into segments for connection with piezoresistors. A sensing piezoresistor is formed on the substrate's top surface in order to respond to a pressure of interest. A reference piezoresistor is formed on the substrate's bottom surface to respond to a reference pressure. A conductive strip is joined between the two piezoresistors for conducting heat and electricity therebetween. A temperature measuring resistor can also be positioned on the substrate. The substrate and sensors can be positioned in a housing having electrical contacts in communication with the sensors for providing voltages in response to changing pressure differentials and temperatures.