A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.

 
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< Oil cooler structure of an automatic transmission

< Polymer with solder pre-coated fillers for thermal interface materials

> Forced air bed warmer/cooler

> Automotive air conditioner

~ 00257