A vacuum conduit connected to a vacuum pump has a shield surface which absorbs radiation to reduce the total radiation falling on the vacuum pump. The vacuum system includes the vacuum conduit connected between a process chamber and the vacuum pump and a surface treatment along at least a portion of the shield surface adapted to absorb radiation. Since the treatment is on the interior surface of the vacuum conduit and does not extend into the center of the conduit, gaseous flow to the pump is not impeded. In this manner radiation entering the vacuum pump and falling on the cryogenic array is reduced without impeding gaseous flow to the cryogenic surface. The system therefore minimizes the radiation load on the cryogenic array in the vacuum pump without impeding the gaseous flow through the vacuum pump.