A large array probe/contact having spring characteristics for relieving stress in the contact caused, for example, by temperature change is fabricated using a unique combination of semiconductor fabrication operations. The contacts in the array have a "U" shaped resilient portion, are fixed at one end to a substrate and have an accessible low electrical noise contact tip. The contacts are encapsulated on the substrate in an elastomer to provide additional stress relief resilience, support and protection from damage during handling.