A method and related configuration for attenuating high-frequency noise that may appear on power planes in printed circuit boards. In one embodiment, the noise attenuation means of the present invention involves applying a lower conductivity material between the conductive and dielectric layers within a printed circuit board. High-frequency noise is then attenuated by the skin effect. In another embodiment, the low conductivity material is applied between the power plane and dielectric layer within the printed circuit board. The low conductivity material may be a material, such as nickel or lead, having an electrical conductivity ranging between about 1.times.10.sup.4 mhos/m and 5.8.times.10.sup.7 mhos/m for layers having a thickness of about 2 mils.