A clamping structure is used to fix a heat-dissipating body on a chip module.
The
clamping structure comprises a clamping body, two clamping portions, a pivot element,
a top frame and a bottom frame. The two clamping portions are respectively connected
to two sides of the clamping body and are clamped to the bottom frame. The pivot
element is pivotally connected to the clamping body and has a movable portion and
an ear piece. The ear piece has a fixed portion and a release portion respectively
formed at an end side thereof for fixing and releasing the heat-dissipating body.
The clamping structure is used to eliminate a spare gap between the clamping element
and the top frame, and clamping element and the bottom frame without using the
elastic element. The clamping structure can also be used with a heat sink to form
a heat-dissipating module.