A power switching module is provided having at least one power switch placed above at least one other power switch, each power switch in turn including an upper wall and a lower wall, each of which is cooled through thermal conduction by a cooling medium that circulates in channels and voids that are provided along the walls for this purpose.

 
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< Temperature adjustment apparatus, exposure apparatus having the same, and device fabricating method

> Using external radiators with electroosmotic pumps for cooling integrated circuits

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