A cooling arrangement for one or more integrated circuits which are mounted in a socket on a printed circuit board and which each are cooled by a cooling element based on a compressor. The surface of each integrated circuit has arranged thereon a cooling element which is formed by an evaporator in the form of a housing (15) which has a lid with protruding cooling rods. Coolant is supplied to the housing (15) via a supply pipe (22, 23) that ends in an inlet stub (24) in the housing, which is constructed such that the coolant changes its direction, such as 90, when entering the interior of the housing. The coolant is returned form the housing via an outlet stub (25) which is concentric with the inlet stub (22). The supply pipe has a smaller diameter than the inlet stub (24) and the outlet stub (25), which means that cooling of the coolant and thereby of the cooling rods takes place in the housing, said cooling being transferred to the individual ICs. With a view to avoiding formation of condensate in connection with the cooling process, the housing is fixed against the printed circuit board according to the invention, a sealing material, such as butyl, being arranged between the housing (15) and the printed circuit board (3). For additional sealing, a rear flange may be fixed on the rear side of the printed circuit board in the area where wires are run to the IC, said rear flange being sealed with butyl against the printed circuit board.