A heating assembly is provided for heating objects, for example, food items, that comprises a substrate attached to an insulating frame, which may optionally be attached to a metal pan. The complete assembly is attached to a cooking appliance. The substrate may take the form of a glass disk, for example, tempered soda-lime silica glass, having a conductive coating disposed on one of its surfaces. Conductive metal bus bars, for example, sprayed copper, are disposed onto and in electrical contact with the coating. A temperature sensor may be placed in thermal contact with the heating assembly. As a result, the temperature sensor would allow a cooking appliance to control the electric current being conducted through the heating assembly and, consequently, the temperature of the object being heated.

 
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