A positive resist composition comprising (A) resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkaline developer, (B) a compound capable of generating an acid upon treatment with one of an actinic ray and radiation and (F) a specific surfactant containing a fluorine atom in an amount of from 30 to 60 mass %, and a pattern-forming method using the same.

 
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< Positive-tone radiation-sensitive resin composition

< Lithographic printing plate precursor requiring no dampening water

> Photosensitive element, photosensitive element roll, process for the preparation of resist pattern using the same, resist pattern, resist pattern laminated substrate, process for the preparation of wiring pattern and wiring pattern

> Method for manufacture of lithographic printing plate precursor no dampening water
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