A method for improving fluidic flow for a microfluidic device having a through
hole or slot therein. The method includes the steps of forming one or more openings
through at least part of a thickness of a substrate from a first surface to an
opposite second surface using a reactive ion etching process whereby an etch stop
layer is applied to side wall surfaces in the one or more openings during alternating
etching and passivating steps as the openings are etched through at least a portion
of the substrate. Substantially all of the etch stop layer coating is removed from
the side wall surfaces by treating the side wall surfaces using a method selected
from chemical treatment and mechanical treatment, whereby a surface energy of the
treated side wall surfaces is increased relative to a surface energy of the side
wall surfaces containing the etch stop layer coating.