This invention provides a method and a support device for a wafer transfer process
which has a first vertical, second horizontal and third compound angled surfaces,
as well as a pair of sidewalls all contiguously connected to one another. The third
surface has at least two angled receiving surfaces whereby one of such angled receiving
surfaces has a small angle of incline for initially receiving and delivering a
wafer. The other angled receiving surface has a steep angle of incline for effectively
receiving, holding and transporting a semiconductor wafer by increasing an effective
coefficient of friction of the wafer to provide a secure resting point for such
wafer during a transfer process while simultaneously increasing the speed thereof.
Furthermore, a hole may be provided in the support device for attaching the support
device, or a plurality of support devices having holes, to an end-effector.