A data output processor is employed when forming a conductive pattern on a layer formed with a plurality of recesses by filling the plurality of recesses with a conductive material by an electrolytic plating. The data output processor includes a parameter input receiving unit which receives a proportion of a recess with a width not exceeding a first reference width in the layer with respect to that layer, an arithmetic processor which calculates an integrated current amount necessary for filling the plurality of recesses with the conductive material in accordance with the proportion, and an output unit which outputs the integrated current amount.