A method of forming a buffer dielectric film in a semiconductor device and a
method
of manufacturing a thin film transistor using the same are disclosed. By forming
a buffer dielectric film containing porous silica material having low heat conductivity
between the amorphous silicon layer and the substrate to minimize the heat transfer
to the substrate and forming the polysilicon active layer using the laser in the
state of securing the crystal growth time, polysilicon active layer having a maximized
crystal particle size can be formed to improve the charge mobility of the device,
in case of crystallizing the amorphous silicon layer by the ELA method, and the
length of the SLG (Super Lateral Grain) can be increased to prevent the nucleation
phenomenon from being generated at the portion that the crystals meet and thus
the moved number of the mask can be minimized and the throughput of the process
can be improved, though the interval of the mask pattern is increased, in case
of crystallizing the amorphous silicon by the SLS method.