An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.