A printed wiring board having differential pair signal traces has increased spacing between signal-carrying vias and ground or power planes and/or is equipped with selectively placed ground vias to enhance the impedance matching of the signal traces.

 
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< Method and apparatus for redundant transmission over TDMA optical networks

< Fiber optic cable retention and guide clip

> In-order delivery of frames during topology change

> Real time call trace capable of use with multiple elements

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