A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.

 
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< Semiconductor device having a shielding layer

< Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound

> Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package

> Incandescent bulb and incandescent bulb filament
~ 00264