A package allowing both electrical and optical coupling between one or more integrated
circuits and a printed circuit board (PCB) has an optical waveguide structure in
addition to electrical connections. An optically active device is flip-chip bonded
directly to an integrated circuit using solder bump technology. The optically active
device has a lens directly attached to it to facilitate optical coupling to the
optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array
(BGA) package. The BGA package is bonded to the PCB using solder reflow technology.