A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.

 
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< Optical coupling element and optical device

< Method and apparatus for distinguishing materials

> Tunable compensation of chromatic dispersion using etalons with tunable optical path length and non-tunable reflectivity

> Commonplace object with a surface that comprises a data track

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