A semiconductor manufacturing equipment comprising a canopy, a semiconductor processing device, a load port, a robot arm or a transferring device, an air vent, and a chemical filter to remove chemical substance in the air. A HEPA or ULPA filter may be included to filter off particulates. The load port may have a standardized mechanical interface (SMIF) suitable for SMIF pods. In the case that the semiconductor processing device is a copper processing tool, an advantage of preventing copper from corrosion is attained in the present invention by removing chemical substance.