A down-hole well tool is disclosed for removing debris from a well utilizing low pressure/suction. More particularly, the tool is adapted to generate the low pressure within a well bore for removing debris while being interconnectable to the end of a single duct tubing that extends to the surface. Use of the low pressure/suction allows removal of debris without of forcing such debris into the permeable formations of the well. In one application, the tool may be utilized during open-hole completion processes. In another application, the tool may be utilized to clean existing wells.