The present invention addresses many of the current limitations in sub-100 nm lithographic techniques by providing novel resists that achieve high sensitivity, high contrast, high resolution, and high dry-etch resistance for pattern transfer to a substrate. In one embodiment, the present invention provides a polymeric resist comprising an adamantyl component and a photoacid generating component.

 
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< Alkali-soluble resin with polyaromatic group and photosensitive composition comprising the resin

< Melts

> Photosensitive composition and color paste

> Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film

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