A remover composition used for cleaning of a semiconductor substrate or semiconductor element, wherein (1) the remover composition contains 65% by weight or more of water; (2) the remover composition has a pH at 20.degree. C. of 2 or more and 6 or less; and (3) the remover composition contains (I) at least one member selected from the group consisting of a saccharide, an amino acid compound, an organic acid salt and an inorganic acid salt, and 0.01 to 1% by weight of ammonium hexafluorosilicate, or (II) an organic phosphonic acid and a fluorine-containing compound. The remover composition of the present invention can be suitably used for manufacturing high-quality electronic parts such as LCD, memory, and CPU.