A method of forming a polysilicon thin film transistor that includes depositing an amorphous silicon layer over a substrate, crystallizing the amorphous silicon layer into a polycrystalline silicon layer, patterning the polycrystalline silicon layer to form a polysilicon active layer for a thin film transistor, depositing silicon oxide over the polysilicon active layer to form a gate insulation layer under a vacuum condition, applying heat to anneal the gate insulation layer under a vacuum condition and forming a gate electrode on the annealed gate insulation layer.

 
Web www.patentalert.com

< Method for measuring etch rates during a release process

< Fabrication of movable micromechanical components employing low-cost, high-resolution replication technology method

> Strained channel transistor and methods of manufacture

> Method to form etch and/or CMP stop layers

~ 00266