A thermal management system is described for cooling an electronic component mounted on a printed circuit board. The thermal management system includes a heat sink coupled to an electronic component generating heat on a primary side of the printed circuit board and a cooling structure coupled to a secondary side of the printed circuit board. The thermal management system further includes a heat transfer element to transfer heat from the heat sink to the cooling structure. The heat transfer element is routed through the printed circuit board to establish thermal connection between the heat sink and the cooling structure.