An electronic parts packaging structure of the present invention includes
a wiring substrate having a wiring pattern, a first insulating film which
is formed on the wiring substrate and which has an opening portion in a
packaging area where an electronic parts is mounted, the electronic parts
having a connection terminal flip-chip mounted on the wiring pattern
exposed in the opening portion of the first insulating film, a second
insulating film for covering the electronic parts, a via hole formed in a
predetermined portion of the first and second insulating films on the
wiring pattern, and an upper wiring pattern formed on the second
insulating film and connected to the wiring pattern through the via hole.