The present invention relates to a wood-polymer composite, particularly wood which has been impregnated with a mixture containing polymerizable organic compounds, and more particularly to a method for preparing a wood-polymer-composite by impregnating wood material and/or wood-based material with a mixture containing polymerizable organic compounds, and most particularly uses thereof.

 
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< Thermistor device, thermistor device manufacturing method and temperature sensor

< Capacitor-grade lead wires with increased tensile strength and hardness

> Non-volatile semiconductor memory device and process for fabricating the same

> Selective hydrogenation catalyst and processes therefor and therewith
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