An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.