A pattern detection method and apparatus for inspecting, with high
resolution, a micro fine defect of a pattern on an inspected object, and
a semiconductor substrate manufacturing method and system with a high
yield. A micro fine pattern on the inspected object is inspected by
annular-looped illumination through an objective lens onto a wafer, the
wafer having micro fine patterns thereon. The illumination may be
polarized and controlled according to an image detected on the pupil of
the objective lens, and image signals are obtained by detecting a
reflected light from the wafer. The image signals are compared with
reference image signals and a part of the pattern showing inconsistency
is detected as a defect. Simultaneously, micro fine defects on the
micro-fine pattern are detected with high resolution. Further, process
conditions of a manufacturing line are controlled by analyzing a cause of
defect and a factor of defect.