A system and method for providing a mechanical joint supporting a printed circuit board and a solder joint of power module terminals to a printed circuit board, as well as a mechanical joint for facilitating a thermal interface between a power module and a heat sink or cold plate is disclosed. The system provides for both mechanical joints through a common mechanical support including a plurality of standoffs mounted to studs projecting from a heat sink or cold plate, wherein the assembly also provides for an insulating spacer to be clamped to the standoffs via a wing nut or similar fastener to support the printed circuit board.